To solve the problems with increasing die wear in the tablet production process, this research attempts to study the relationship between mold hole chamfer and stress and deformation from the ring mold hole axial path, through modeling die bore and finite element static analysis with CATIA V5R16. The conclusion is when middle-die hole chamfer is 67.5 °, die wear gets smaller. Afterwards, the experiment of granulation practice shows that the modified middle-die can remarkablely prevent mold bore wear.